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Process
Quality Objectives: To achieve zero defect with continuous quality improvement program.
Quality improvement never stop!
2,200K of SMT components per day.
800K of DIP components per day.
From SMD 0402 to SMD 0.30 fine pitch & Micro BGA.
In-Circuit, Functional and AOI. |
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QC
Equipment
- 3 SMT lines, 2 DIP lines and 3 assembly lines.
Standards & Approvals
ISO9001:2000, ISO14001:2004
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