Printed Circuit Board Assembly
Might integrates quality ISO & TS certified systems and innovative assembly and packaging technologies to deliver market - leading consumer electronic products. From product assembly through enclosures to testing and packaging. Might SMT & thru-hole lines utilize the most advanced technologies in the industry including:
1. Flip chip technologies.
2. 0201, micro BGA, AI, thru-hole assembly.
3. Lead - free solder technology.
4. Alternative PCB finishes.
- ISO 9001\n TUV\n 3C\n UL and TS16949 Registered Quality System
Main Product:
Finished Goods Assembly, SMD and Through Hole Assembly, Mechanical Assembly, Water Heater (Own Brand), Material Procurement, Plastic Injection Molding, Sheet Metal Stamping, Die Casting Molding, Aluminum Extrusion, CNC Machinery Parts, Silicone Rubber Molding, Membrane Keypads, Terminal Crimping and