Might integrates quality ISO & TS certified systems and innovative assembly and packaging technologies to deliver market - leading consumer electronic products. From product assembly through enclosures to testing and packaging. Might SMT & thru-hole lines utilize the most advanced technologies in the industry including: 1. Flip chip technologies. 2. 0201, micro BGA, AI, thru-hole assembly. 3. Lead - free solder technology. 4. Alternative PCB finishes.
Specifications:
Certificate:
ISO 9001, TUV, 3C, UL and TS16949 Registered Quality System
Ordering information:
- Minimum Order: Negotiable