Might Electronic Co., Ltd.
|
Product ID: 11
SMT Assembly
Might integrates quality ISO & TS certified systems and innovative assembly and packaging technologies to deliver market - leading consumer electronic products. From product assembly through enclosures to testing and packaging. Might SMT & thru-hole lines utilize the most advanced technologies in the industry including: 1. Flip chip technologies. 2. 0201, micro BGA, AI, thru-hole assembly. 3. Lead - free solder technology. 4. Alternative PCB finishes.
|

Click here for details.
|
|
Certificate:
- ISO 9001
- TUV
- 3C
- UL and TS16949 Registered Quality System
|