Might integrates quality ISO & TS certified systems and innovative assembly and packaging technologies to deliver market - leading consumer electronic products. From product assembly through enclosures to testing and packaging. Might SMT & thru-hole lines utilize the most advanced technologies in the industry including:
1. Flip chip technologies.
2. 0201, micro BGA, AI, thru-hole assembly.
3. Lead - free solder technology.
4. Alternative PCB finishes.
Certificate:
- ISO 9001
- TUV
- 3C
- UL and TS16949 Registered Quality System
Ordering information:
- Minimum Order: Negotiable
- FOB: Taiwan, Hong Kong