Seh Tai Fon Trading Co., Ltd.

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Fuse

Product ID: C1Q

Fuse

More details specifications

Surface mount very fast-action chip fuse.

Specifications:
  • Environmental Specification:
    • 1206 Size.
    • Soldering Conditions:
      • Infrared Reflow: 260 Celsius, 20 sec max.
      • Wave Solder: 260 Celsius, 10 sec max. (MIL-STD-202, Method 210)
      • Solderability: MIL-STD-202, Method 208
    • Shock: MIL-STD-202. Method 213, Test Condition I (100 G's peak for 6 milliseconds)
    • Vibration: MIL-STD-202, Method 201 (10-55 Hz, 0.06 inch, total excursion)
    • Salt Spray: MIL-STD-202, Method 101, Test Condition B (48 Hrs)
    • Insulation Resistance: MIL-STD-202, Method 302, Test Condition A (After Opening) 10,000 ohms minimum
    • Resistance to Solder Heat: MIL-STD-202, Method 201, Test Condition F (260 Celsius, 20 sec)
    • Thermal Shock: MIL-STD-202, Method 107, Test Condition B (-65 Celsius to +125 Celsius)
    • Operating Temperature: -55 Celsius to +125 Celsius

Catalog Number Ampere Rating Typical Cold Resistance (ohm) Volt-drop @ 100 % In (Volt) max. Melting I ² T < 10 mSec (A ² Sec) Melting I ² T @ 10 In (A ² Sec) Maximum Power Dissipation (W)
C1Q 250 250 mA 1.20 0.50 0.001 0.00004 0.14
C1Q 375 375 mA 0.69 0.43 0.003 0.0001 0.18
C1Q 500 500 mA 0.47 0.40 0.006 0.0003 0.21
C1Q 750 750 mA 0.254 0.34 0.019 0.0008 0.28
C1Q 1 1 A 0.187 0.31 0.033 0.0016 0.34
C1Q 1.25 1.25 A 0.138 0.29 0.058 0.0030 0.40
C1Q 1.5 1.5 A 0.109 0.27 0.091 0.0049 0.45
C1Q 2 2 A 0.075 0.25 0.18 0.010 0.54
C1Q 2.5 2.5 A 0.056 0.23 0.32 0.019 0.63
C1Q 3 3 A 0.045 0.22 0.51 0.032 0.71
C1Q 3.5 3.5 A 0.037 0.20 0.76 0.048 0.79
C1Q 4 4 A 0.032 0.20 1.0 0.07 0.86
C1Q 5 5 A 0.024 0.18 1.8 0.12 1.00

Main Products:
Fuse

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Contact Details

CEO: Mr. C. H. Lin
Sales Contact: Sales Manager/Mr. Alan Lin
Minimum Order:Negotiable
Address:9F-2, No. 250, Sec. 4, Chung Hsiao E. Rd. Taipei, 106 Taiwan, R.O.C.
Tel:886-2-27216144
Fax:886-2-27817698