Sputtering target bonding service
Product ID:
During so many years of engaging in the bonding process, TTMC employs a special metallization process in order to avoid the traditional flaws of high cost in metallization and inconvenience in the sputtering process. It is the best option for certain applications, particularly like bonding large scale target.
Application
- Bonding for various metal targets.
- Bonding for hard and crispy ceramic target.
- Bonding for target employed in large scale display.
Characteristics
- Multiple target bonding service: suitable for various metal, ceramic and oxide targets including more than 100 kinds of different materials that can be bonded.
- Expandability for large scale bonding: particularly fit for future large scale target for TFT-LCD beyond the 10th generation.
- Complete and precise supersonic examination equipment: appropriate for securing the reliability of the bonding quality.
- C-Scan equipment, other production equipment and moving and handling equipment may cover all the demands of producing TFT-LCD even beyond 10th generation.
Leverage for bonding target
- Protecting target, suitable for ceramic and fragile target.
- Matching with backing plate can be suitable for special chamber and cooling piping arrangement.
- Economical and environmentally-friendly, suitable for large scale target that may save material; back steel can be reused.
Main Products:
conductive paste for solar cell, thin film for sputtering target, target bonding service, precious metal refining, injection molding bi-metal barrel and special alloy powder.
Contact Details
Minimum Order:Negotiable
Address:No.1, Luke 8th Rd., Lujhu District, Kaohsiung City 82151, Taiwan (R.O.C.)
Tel:+886-7-6955125
Fax:+886-7-6955205
E-mail:
service@e-ttmc.com.tw
