1.Bare chip,Flip chip,Dram,LED.2.Wafer level package(wlp) chip.3.Smt components,connectors.
Others:
| Tape product size | 8,12,16,24,32,44,56(mm) |
|---|---|
| Throughput | >=6000 UPH (units per. hour) |
| Pick & Place Accuracy | ±50u m |
| Heater | DC/AC; 40W x 2, 40W x 4 |
| Facilities | 110V AC/1phase/60Hz; Air: 4~6kgf/cm² |
| Weight | Approx. 200kg |
| Machine Dimensions | 1500(W) x 600(D) x 1910(H)mm |
Ordering information:
- Minimum Order: Negotiable