Detail Description
Base material: FR4, Aluminum,Ceramics,Rogers,F4B,F4BK,F4BT,TP,TF,FR1, FR2, CEM-1, CEM-3,etc
Board thickness: 0.30 to 3.20mm (12 to 26mil)
Copper thickness: 0.50 to 5 ounce
Solder mask: LPI solder mask, conventional solder mask, peelable solder mask, UV solder mask
Minimum line width: 0.1mm (4mil)
Minimum line space: 0.1mm (4mil)
Minimum hole diameter: 0.25mm (10mil)
PTH hole diameter tolerance: +/-0.076mm (+/-3mil)
NPTH hole diameter tolerance: +/-0.03mm (+/-1.2mil)
Maximum board size: 460 x 620mm (18 x 24)
Board finishing type: Hot air leveling, soft gold, hard gold, immersion gold, gold fingers
Specifications:
- aluminum base pcb
- Base material: FR4, Aluminum,Ceramics,Rogers,F4B,F4BK,F4BT,TP,TF,FR1, FR2, CEM-1, CEM-3,etc
- Board thickness: 0.30 to 3.20mm (12 to 26mil)
- Copper thickness: 0.50 to 5 ounce
- Solder mask: LPI solder mask, conventional solder mask, peelable solder mask, UV solder mask
- Minimum line width: 0.1mm (4mil)
- Minimum line space: 0.1mm (4mil)
- Minimum hole diameter: 0.25mm (10mil)
- PTH hole diameter tolerance: +/-0.076mm (+/-3mil)
- NPTH hole diameter tolerance: +/-0.03mm (+/-1.2mil)
- Maximum board size: 460 x 620mm (18 x 24)
- Board finishing type: Hot air leveling, soft gold, hard gold, immersion gold, gold fingers
- aluminum base pcb
- Detail Description
- Base material: FR4, Aluminum,Ceramics,Rogers,F4B,F4BK,F4BT,TP,TF,FR1, FR2, CEM-1, CEM-3,etc
- Board thickness: 0.30 to 3.20mm (12 to 26mil)
- Copper thickness: 0.50 to 5 ounce
- Solder mask: LPI solder mask, conventional solder mask, peelable solder mask, UV solder mask
- Minimum line width: 0.1mm (4mil)
- Minimum line space: 0.1mm (4mil)
- Minimum hole diameter: 0.25mm (10mil)
- PTH hole diameter tolerance: +/-0.076mm (+/-3mil)
- NPTH hole diameter tolerance: +/-0.03mm (+/-1.2mil)
- Maximum board size: 460 x 620mm (18 x 24)
- Board finishing type: Hot air leveling, soft gold, hard gold, immersion gold, gold fingers
- UL
- ISP9001
- Minimum Order: 1
- FOB: Shenzhen