Product ID: FFP

EMC Front Filler Panels (FFP)

Your Advantage
1. Flexible in height and width.
2. Inexpensive customization (holes, openings).
3. EMC spring integrated in front panel.
4. Compatible to IEEE standard.
5. Can be used in combination with aluminum version.

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• Material
• Aluminum 2.5mm
• Front anodized, rear conductive
• Scope Of Delivery
• Front panel
• Card holder with / without handles, pre-assembled
• EMC spring
• Fixing material (screws M2.5 for front panel / card holder / boards)

Features:

• Hedif offers the following panel customization services
• High speed milling suitable for volumes from 1-2,000 panels.
• Punching suitable for volumes of 2,000+ panels.
• Silk-screening.
• Painting.
• Overlays.
• Assembly of handles and springs.
• OEM / ODM product.
• Branded product.
• Buyer's label offered.
• Sample purchase.

Certificate: IEEE 1101.10 / 1101.11

• Minimum Order: Negotiable