Ball Grid Array IC Assembly

Product ID: BGA

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BGA is one high-pincount IC with 256 balls to 529 balls. CWT has 3 plastic body size which are 27 x 27, 35 x 35, 37.5 x 37.5mm respectively. CWT can assemble BGA package with high quality & reliability. Multi-chip module(MCM) can also be specially designed per customer required.
Specifications
  • 1000 cycle temp. cycle
  • 1000 cycle thermal shock
  • 300 hour pressure cook
  • 1000 hour 85/85
  • 1000 hour high temp. storage
  • BGA-256, BGA-272, BGA-292, BGA-328, BGA-348, BGA-352, BGA-388, BGA-436, BGA-456, BGA-480, BGA-529
Features
.The products passed jedec level 3 precondition

Main Products

IC assembly & package