Because printed circuit board is developing in the direction of fine line, high density, small aperture and multiplied layers, apart from that the requirement for inner and outer quality of base material (copper foil coated panel) is extremely high, more and more rigorous requirements are proposed on manufacturing environment and lustration of process. The pollutants, such as dust, textile fiber, copper scraps, resin particles brought by the air in the production place and the working procedure, shall enable the surface of copper coated panel to have pressed pit, pressed mark, speckles and enable printed circuit board and multi-layer panel to have open circuit or short circuit and other faults. In order to reduce the adverse influence brought by dust particles and fibers to the copper coated panel and printed circuit board, our company introduces clean cloth available for the use of copper coated panel, printed circuit board and multi-layer panel. This product is made in such manner that the pure cotton cloth is immersed in glue. Different products such as low viscosity, medium viscosity, high viscosity and extreme high viscosity type can be produced according to the different demands and purposes of consumers so as to satisfy the optimum clean result.