FOG/FOB Bonding M/C

Product ID: XCM71-A5

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Application:
The machine is used for bonding FPC, COF, TAB onto various LCD panels and PCB.

Key Feature:
a. Double cylinders of SUNSOM pressure system can eliminate the self-gravity. Minimum pressure accuracy is 0.1kg.
b. Multi-level pulse source design meet the pressure requirement of diversified products.
c. Servo memory function and auto-location function meet the efficiency of alignment, assembly and repair work.
d. Japanese precise SMC pressure components.
e. Interstice vacuum suction of bond head rotary work, save one second suction time and reduce the gas wastage.

Basic Parameter
Voltage:AC220V 50-60HZ
Rating Power:1.5KW (constant heat) 4kw (pulse heat)
Operation Mode:7" interface
LCD Table:Servo memory and auto-location system
Input Gas:0.4-0.8Mpa
Fixture:Micrometer adjust X-Y-θaxis
Bond Head :60 mm(constant heat) 50mm(pulse heat)
Thermocouple:K type
Rolling Mode:Auto
Program Control: PLC and servo controller
Vision System:Two C/L CCD
Heat Mode: Constant heat and pulse heat
Weight:300kg
Dimension:L1200 x W895 x H1440mm

Main Products

LCD Bonding Machine