COG Bonding(Alignment) M/C

Product ID: XCG53-A2

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Application:
The machine is used for aligning and bonding IC driver to various LCD glasses.

Key Feature:
a. Japanese controlling system and precise servo system.
b. Precise THK linear modules auto-adsorb IC and alignment.
c. High clearance CCD alignment vision system, cross mark alignment.
d. Precise micrometer adjustable X-Y-θaxis of fixture.
e. Panasonic human-machine interface, can store 50 set parameters.


Basic Parameter
Voltage:AC220V 50-60HZ
Rating Power:0.75KW
Pressure: 0.4-0.8Mpa
Stored Parameter: 50 sets
Operation Mode:7" interface
Work Mode:Double stations fixed work
Alignment System: Cross mark position
Aligning Accuracy:±3um
Bond Head:L1-45mm W1-5mm(Customized)
Ambient Treatment: FFU high efficient filtration
Fixture:Micrometer adjust X-Y-θaxis
IC Tray:2" 3" 4"
Weight:250kg
Dimension:L1000 xW770x H1650MM

Main Products

LCD Bonding Machine