GAP PAD HC 5.0
BERGQUIST GAP PAD TGP HC5000 Formerly known as GAP PAD HC 5.0
Highly Conformable, Thermally Conductive, Low-Modulus Material
Features and Benefits
• Thermal conductivity: 5.0 W/m-K
• High-compliance, low compression stress
• Fiberglass reinforced for shear and
tear resistance
BERGQUIST GAP PAD TGP HC5000 is a soft and compliant gap filling material with a thermal conductivity of 5.0 W/m-K.The material offers exceptional thermal performance at low pressures due to a unique filler package and low-modulus resin formulation. The enhanced material is ideal
for applications requiring low stress on components and boards during assembly.
BERGQUIST GAP PAD TGP HC5000 maintains a conformable nature that allows for excellent interfacing and wet-out characteristics, even to surfaces with high roughness and/or topography.
BERGQUIST GAP PAD TGP HC5000 is offered with natural inherent tack on both sides of the material, eliminating the need for thermally-impeding adhesive lay
Highly Conformable, Thermally Conductive, Low-Modulus Material
Features and Benefits
• Thermal conductivity: 5.0 W/m-K
• High-compliance, low compression stress
• Fiberglass reinforced for shear and
tear resistance
BERGQUIST GAP PAD TGP HC5000 is a soft and compliant gap filling material with a thermal conductivity of 5.0 W/m-K.The material offers exceptional thermal performance at low pressures due to a unique filler package and low-modulus resin formulation. The enhanced material is ideal
for applications requiring low stress on components and boards during assembly.
BERGQUIST GAP PAD TGP HC5000 maintains a conformable nature that allows for excellent interfacing and wet-out characteristics, even to surfaces with high roughness and/or topography.
BERGQUIST GAP PAD TGP HC5000 is offered with natural inherent tack on both sides of the material, eliminating the need for thermally-impeding adhesive lay
Main Products
Thermal insulation material for Bergquist