printed circuit board manufacturing
Layers: 2L
Material: fr4
TG: TG130
Board thickness: 1.6mm
Copper thickness: 1OZ
Solder mask color: green
Silk screen color: white
Finish: lead free HASL
Min hole: 0.25mm
Min line width/space: 0.25/0.25mm
Min PTH copper thickness: 20um
Criteria: SGS UL ISO9001
Materials that we keep in stock are:
FR4 (Tg – 135C, 145C, 170C)
Rogers Ultralam 2000
Rogers RO4350
Rogers RO4003
Polyimide
Teflon
Black FR4
Getek Copper
Clad Thermal Substrates
Hybrid (Rogers and FR4)
BT Epoxy
Nelco 4013
Surface finishing that we are able to provide our customers:
HASL – Leaded Solder Tin/Nickel
HASL – Lead Free Solder
Electroless Soft Gold
Wire Bondable Soft Gold
Nickel Flash Gold
Electroless Nickel
Immersion Gold OSP
Electrolytic Nickel /Hard Gold and Selective Gold
Immersion Silver
Immersion Tin
Carbon Ink
ENIG
Material: fr4
TG: TG130
Board thickness: 1.6mm
Copper thickness: 1OZ
Solder mask color: green
Silk screen color: white
Finish: lead free HASL
Min hole: 0.25mm
Min line width/space: 0.25/0.25mm
Min PTH copper thickness: 20um
Criteria: SGS UL ISO9001
Materials that we keep in stock are:
FR4 (Tg – 135C, 145C, 170C)
Rogers Ultralam 2000
Rogers RO4350
Rogers RO4003
Polyimide
Teflon
Black FR4
Getek Copper
Clad Thermal Substrates
Hybrid (Rogers and FR4)
BT Epoxy
Nelco 4013
Surface finishing that we are able to provide our customers:
HASL – Leaded Solder Tin/Nickel
HASL – Lead Free Solder
Electroless Soft Gold
Wire Bondable Soft Gold
Nickel Flash Gold
Electroless Nickel
Immersion Gold OSP
Electrolytic Nickel /Hard Gold and Selective Gold
Immersion Silver
Immersion Tin
Carbon Ink
ENIG
Certificate
- UL
- SGS
- ISO
Main Products
pcb/pcb assembly/pcba/printed circuit board/doule side /multilayer pcb