Board Thickness:Rigid: 1.5mm +/-0.15; Flex: 0.13mm +/-0.03
Material :FR4 TG170 +Polyimide (Adhesiveless)
Copper Thickness:1/1/1/1/1/1/1/1 OZ
Stiffener: None
Min. Line Width/ Spacing: 4mil (0.10mm)/4mil (0.10mm)
Coverlay:Yellow
Silkscreen Color:White
Solder mask Color:Green
Surface Finishing:ENIG（Ni: 3-5um/Au: 0.05um)
Layer Count:8 Layer （6rigid+2flex）
Impedance controlled: 50Ω±10%, differential 100Ω ±10%
Min.Quantity of Order:No MOQ
Material :FR4 TG170 +Polyimide (Adhesiveless)
Copper Thickness:1/1/1/1/1/1/1/1 OZ
Stiffener: None
Min. Line Width/ Spacing: 4mil (0.10mm)/4mil (0.10mm)
Coverlay:Yellow
Silkscreen Color:White
Solder mask Color:Green
Surface Finishing:ENIG（Ni: 3-5um/Au: 0.05um)
Layer Count:8 Layer （6rigid+2flex）
Impedance controlled: 50Ω±10%, differential 100Ω ±10%
Min.Quantity of Order:No MOQ
Certificate
- ISO9001:2008
Main Products
Printed circuit boards