/Layer Counts 1~64
Board Thickness 10.0mm
/Board Thickness 0.6mm
Drill Size CNC:0.2mm
Laser:4mil
/Aspect Ratio 16:1
/Dimension 610mm×1100mm
/Line&Space 3mil/3mil
/Impedance Tolerance ±10%
/Min Core Thickness 3mil
Surface Finish HASL PB FREE /HASL
/Immersion Gold
Immersion Tin
/Immersion Silver
Gold Finger Plating
/OSP
Selective OSP &
/Immersion Gold
Materials Common FR4 S1141
MTC-97
LDPP
Middle Tg FR4 S1000
IT158
High Tg FR4 S1170
GA170
S1000-2
EM827
IT180
Modified FR4 MCL-BE-67
GXA-67N(PP)
N4000
Rogers R4350
R4003
R4403(PP)
Halogen Free GA-HFTL Tg170℃
GA-HFB(PP) Tg170℃
S1155
S0155(PP)
PPO/PPE PCL-LD621/PCL-LDP-621
GETEK
RCC LG-F-2000
S6018
PTFE TLC-32
RF-35
TLX
N9000
25N/25FR
Diclad
Cuclad
Isoclad
SpeedBoardC
Board Thickness 10.0mm
/Board Thickness 0.6mm
Drill Size CNC:0.2mm
Laser:4mil
/Aspect Ratio 16:1
/Dimension 610mm×1100mm
/Line&Space 3mil/3mil
/Impedance Tolerance ±10%
/Min Core Thickness 3mil
Surface Finish HASL PB FREE /HASL
/Immersion Gold
Immersion Tin
/Immersion Silver
Gold Finger Plating
/OSP
Selective OSP &
/Immersion Gold
Materials Common FR4 S1141
MTC-97
LDPP
Middle Tg FR4 S1000
IT158
High Tg FR4 S1170
GA170
S1000-2
EM827
IT180
Modified FR4 MCL-BE-67
GXA-67N(PP)
N4000
Rogers R4350
R4003
R4403(PP)
Halogen Free GA-HFTL Tg170℃
GA-HFB(PP) Tg170℃
S1155
S0155(PP)
PPO/PPE PCL-LD621/PCL-LDP-621
GETEK
RCC LG-F-2000
S6018
PTFE TLC-32
RF-35
TLX
N9000
25N/25FR
Diclad
Cuclad
Isoclad
SpeedBoardC
Certificate
- 9001
Main Products
power bank , bluetooth headphone , pcb board , bluetooth speaker