High Density Interconnect
Number of Layers：4-24layers
Order Quantity：1pc-10000+pcs
Material： FR-4 standard Tg140ºC,FR-4 High Tg170ºC,FR-4 and Rogers combined lamination
Board Thickness：0.02-0.12(0.4mm-3.0mm)
Copper Weight：0.5oz-2.0oz(18μm-70μm)
Min Drilling Hole Diameter：6mil(0.15mm),4mil(0.10mm)-laser drill
Surface Finish：HASL-Hot Air Solder Leveling，Lead Free HASL-RoHS，ENIG-Electroless Nickle/Immersion Gold-RoHS，Immersion Silver-RoHS
Immersion Tin-RoHS，OSP-Organic Solderability Preservatives-RoHS
Order Quantity：1pc-10000+pcs
Material： FR-4 standard Tg140ºC,FR-4 High Tg170ºC,FR-4 and Rogers combined lamination
Board Thickness：0.02-0.12(0.4mm-3.0mm)
Copper Weight：0.5oz-2.0oz(18μm-70μm)
Min Drilling Hole Diameter：6mil(0.15mm),4mil(0.10mm)-laser drill
Surface Finish：HASL-Hot Air Solder Leveling，Lead Free HASL-RoHS，ENIG-Electroless Nickle/Immersion Gold-RoHS，Immersion Silver-RoHS
Immersion Tin-RoHS，OSP-Organic Solderability Preservatives-RoHS
Main Products
Rigid PCB,PCBA,Aluminum PCB,HDI PCB,Flex-rigid PCB