High Density Interconnect
Number of Layers:4-24layers
Order Quantity:1pc-10000+pcs
Material: FR-4 standard Tg140ºC,FR-4 High Tg170ºC,FR-4 and Rogers combined lamination
Board Thickness:0.02-0.12(0.4mm-3.0mm)
Copper Weight:0.5oz-2.0oz(18μm-70μm)
Min Drilling Hole Diameter:6mil(0.15mm),4mil(0.10mm)-laser drill
Surface Finish:HASL-Hot Air Solder Leveling,Lead Free HASL-RoHS,ENIG-Electroless Nickle/Immersion Gold-RoHS,Immersion Silver-RoHS
Immersion Tin-RoHS,OSP-Organic Solderability Preservatives-RoHS
Order Quantity:1pc-10000+pcs
Material: FR-4 standard Tg140ºC,FR-4 High Tg170ºC,FR-4 and Rogers combined lamination
Board Thickness:0.02-0.12(0.4mm-3.0mm)
Copper Weight:0.5oz-2.0oz(18μm-70μm)
Min Drilling Hole Diameter:6mil(0.15mm),4mil(0.10mm)-laser drill
Surface Finish:HASL-Hot Air Solder Leveling,Lead Free HASL-RoHS,ENIG-Electroless Nickle/Immersion Gold-RoHS,Immersion Silver-RoHS
Immersion Tin-RoHS,OSP-Organic Solderability Preservatives-RoHS
Main Products
Rigid PCB,PCBA,Aluminum PCB,HDI PCB,Flex-rigid PCB