Mobile phone repairing machine WDS-650 for HTC/Samsung/iphone IC

Product ID: bga rework machine

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WDS-650 Technology parameter: power 5300W
2.Upper heating power 1200W
3.Lower heating power Second temperature zone 1200W,Third temperature zone2700W
4.Power supply (Single Phase)AC 110V/220V±10 50Hz±3 5.2KVA
5.Overall dimension L880×W880×H720mm ( not include the display holder)
6.Locating way
V-shaped groove,PCB holder can adjust any direction of X,Y
7.Temperature controlling
(high precision K-sensor)(Closed Loop),UP and down can test the temperature independently
8.Large PCB size 450×430mm
9.Small PCB size 10×10mm
10.Chip zoom multiple 2-50 multiple
11.Weight of machine 85kg
  • CE ISO

Main Products

BGA rework station,BGA repair machine,bga reballing machine