PCB & PCBA CLONE
Layers: Single Sided,2 to 20 Layer
Board material type: FR4,CEM-1,CEM-3,ceramic substrate board, aluminum based board, high-Tg, Rogers and more
· Compound material lamination: 4 to 6 layers
· Maximum dimension: 610 x 1,100mm
· Board thickness coverage: 0.2 to 3.00mm
· Board thickness tolerance: ±0.05
· Board thickness tolerance: ±10%
· Minimum line width: 4 mil
· Minimum line space: 4 mil
· Outer layer copper thickness: 12 to 175µm
· Inner layer copper thickness: 12 to 105µm
· min Drilling hole diameter (mechanical drill):0.20 mm
· Finished hole diameter (mechanical drill): 0.20 mm
· Tolerance of drilled slot:±3mil(±75um)
· Accuracy of Hole position:±2mil(±50um)
· Board thickness and hole diameter ratio: 10:1
· Solder mask type: green, yellow, black, purple, blue, white and red
· Thickness of solder mask:0.4-1.2mil(line end) ≥0.2mil(line comer)
·Hardness of solder mask:6H
· Solder mask registration tolerance :±1.5mil(±38um)
·Min solder mask dam:4.0mil(100um)
· Surface finish:HAL,HAL lead free ,ENIG, immersion silver, gold plating, immersion tin and gold finger
In order to make the customers more convenient,We set up a new department to provide a new service since 2006 to help customers purchase of electronic component and SMT,DIP processing. if required,We can provide assembly and testing,also to provide regular technical support.
Layers: Single Sided,2 to 20 Layer
Board material type: FR4,CEM-1,CEM-3,ceramic substrate board, aluminum based board, high-Tg, Rogers and more
· Compound material lamination: 4 to 6 layers
· Maximum dimension: 610 x 1,100mm
· Board thickness coverage: 0.2 to 3.00mm
· Board thickness tolerance: ±0.05
· Board thickness tolerance: ±10%
· Minimum line width: 4 mil
· Minimum line space: 4 mil
· Outer layer copper thickness: 12 to 175µm
· Inner layer copper thickness: 12 to 105µm
· min Drilling hole diameter (mechanical drill):0.20 mm
· Finished hole diameter (mechanical drill): 0.20 mm
· Tolerance of drilled slot:±3mil(±75um)
· Accuracy of Hole position:±2mil(±50um)
· Board thickness and hole diameter ratio: 10:1
· Solder mask type: green, yellow, black, purple, blue, white and red
· Thickness of solder mask:0.4-1.2mil(line end) ≥0.2mil(line comer)
·Hardness of solder mask:6H
· Solder mask registration tolerance :±1.5mil(±38um)
·Min solder mask dam:4.0mil(100um)
· Surface finish:HAL,HAL lead free ,ENIG, immersion silver, gold plating, immersion tin and gold finger
In order to make the customers more convenient,We set up a new department to provide a new service since 2006 to help customers purchase of electronic component and SMT,DIP processing. if required,We can provide assembly and testing,also to provide regular technical support.
Main Products
PCB assembly