iLEDm Photoelectronics, Inc. develops high quality COB flat surface light engine packaged on aluminium or copper board, which improves heat conductivity, lowers light decay and improves light efficiency. Most importantly the advanced packaging technology of iLEDm does not have the need of a frame of any kind on the luminous body, this new packaging technology improves the beam angle. The multichip packaging technology has a luminosity of 100 Lumen/Watt, CRI (Ra) of 85 and uniformity of light distribution. The COB light engine has no need of a secondary optical, which excluded the cost on diffusion layer design; this also ensures no multi image ghosting. The COB engine is the future of LED.
Factory LocationTaipei, Taiwan
- OEM Manufacturer
- ODM Manufacturer
North America / South America / Caribbean / West Europe / East Europe / Russia / East Asia / Southeast Asia / Mid-East / Africa / Australia / New Zealand / China / Hong Kong / globle