Specification for FPC Manufacture:
Item
FPC
PCB
Rigid Flex
Layers
1-8 layers
1-38 layers
2-4 layer
Board Thickness
0.05-0.5mm
0.2-5mm
0.3-2.2mm
Min.line width/space
0.04/0.04mm
0.075/0.075mm
0.1/0.1mm
Min.Through Hole Size
0.2mm
0.25mm
0.5mm
PTH Hole Dia.Tolerance
&≤0.8mm 0.05mm
&≥0.8mm ±0.075mm
&≤0.8mm ±0.05mm
&≥0.8mm ±0.075mm
&≤0.8mm ±0.05mm
&≥0.8mm ±0.075mm
Solder Mask Registration Tolerance
±0.05mm
±0.05mm
±0.05mm
Min.Routing Dimension Tolerance
±0.05mm
±0.1mm
±0.1mm
Hole to edge(Hard tool/Die Cut)
±0.1/±0.2mm
Eege to Edge(Hard tool/Die Cut)
±0.05/±0.2mm
Circuit to edge(Hard tool/Die Cut)
±0.07/±0.2mm
Surface Treating Technology
Electrical Flash Gold,Anti-Tarnish(OSP),
Immersion Nickel-gold,HASL,Immersion Tin
Item
FPC
PCB
Rigid Flex
Layers
1-8 layers
1-38 layers
2-4 layer
Board Thickness
0.05-0.5mm
0.2-5mm
0.3-2.2mm
Min.line width/space
0.04/0.04mm
0.075/0.075mm
0.1/0.1mm
Min.Through Hole Size
0.2mm
0.25mm
0.5mm
PTH Hole Dia.Tolerance
&≤0.8mm 0.05mm
&≥0.8mm ±0.075mm
&≤0.8mm ±0.05mm
&≥0.8mm ±0.075mm
&≤0.8mm ±0.05mm
&≥0.8mm ±0.075mm
Solder Mask Registration Tolerance
±0.05mm
±0.05mm
±0.05mm
Min.Routing Dimension Tolerance
±0.05mm
±0.1mm
±0.1mm
Hole to edge(Hard tool/Die Cut)
±0.1/±0.2mm
Eege to Edge(Hard tool/Die Cut)
±0.05/±0.2mm
Circuit to edge(Hard tool/Die Cut)
±0.07/±0.2mm
Surface Treating Technology
Electrical Flash Gold,Anti-Tarnish(OSP),
Immersion Nickel-gold,HASL,Immersion Tin
Main Products
pcb,pcba