Our Normal, High Tg & Halogen-free FR4, which have High Temperture resistance, Tg up to 180 oC, Better dimensioanl stability, Smaller Z axis CTE, and our CAF resistance FR4 which have high reliability can pass thru 1000/2000 hr ageing test.
Specifications
MCL-BE-67G(H)^$Environment-Friendly
Halogen Free
Adaptable to Lead-free Soldering process
High Reliability
CAF restraining
Through hole reliability
Electrical Properties
Low Transmission Loss
Stability of Dk and Df
Adaptable for High Layer count PWB
Lower CTE in Z direction
^#MCL-E-679(W)^$Tg > 170 oC by TMA method
Excellent Through hole reliability
High Heat Resistance
Good CAF Restraining Property
Good processability (for drilling / punching)
Suitable for Lead-Free process
Cooperate with Hitachi^#MCL-E-679F(J)^$High Tg (170-175 oC by TMA method)
High Heat resistance (288 oC/20 sec dip after PCT-5 hr OK)
Suitable for Lead-Free process
Lower CTE in Z-direction
High Reliability - Superior CAF restraining property
Filler
Cooperate with Hitachi^#HR01^$High Tg (> 170 oC)
Phenolic cured (Dicy Free) system
High Td (decomposition temp. > 340 oC by TGA)
Lead free process compatible (260 oC IR reflow 6x + 288 oC solder flow 6x, no delamination)
Lower Coefficient of Thermal Expansion (< 3.0% from 50 - 260oC)
High heat resistance demonstrated by T-260, T-288 and T-300
T-260 > 60 min.
T-288 > 20 min.
T-300 > 10 min.
Over 15 cycles by thermal stress 288 oC and 310 oC, 10 sec solder float.
^#HR02^$High Tg (> 170 oC)
Phenolic cured (Dicy Free) system with inorganic filler
High Td (decomposition temp. > 340 oC by TGA)
Lead free process compatible (260 oC IR reflow 6x + 288 oC solder flow 3x, no delamination)
Low Coefficient of Thermal Expansion (< 2.8% from 50 - 260oC)
High heat resistance demonstrated by T-260, T-288 and T-300
T-260 > 60 min.
T-288 > 20 min.
T-300 > 10 min.
Over 15 cycles by thermal stress 288 oC and 310 oC, 10 sec solder float^#
Main Products
Normal, High Tg, Halogen free FR4.
