Laminate FR4

Product ID: MCL-BE-67G(H)

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Environment-Friendly
Halogen Free
Adaptable to Lead-free Soldering process
High Reliability
CAF restraining
Through hole reliability
Electrical Properties
Low Transmission Loss
Stability of Dk and Df
Adaptable for High Layer count PWB
Lower CTE in Z direction
Cooperate with Hitachi chemical
Specifications
  • E-679 (W)^$Tg > 170 oC by TMA method
  • Excellent Through hole reliability
  • High Heat Resistance
  • Good CAF Restraining Property
  • Good processability (for drilling / punching)
  • Suitable for Lead-Free process
  • Cooperate with Hitachi chemical^#F-679F(J)^$High Tg (170-175 oC by TMA method)
  • High Heat resistance (288 oC/20 sec dip after PCT-5 hr OK)
  • Suitable for Lead-Free process
  • Lower CTE in Z-direction
  • High Reliability - Superior CAF restraining property
  • Filler
  • Cooperate with hitachi chemical^#HR01^$High Tg (> 170 oC)
  • Phenolic cured (Dicy Free) system
  • High Td (decomposition temp. > 340 oC by TGA)
  • Lead free process compatible (260 oC IR reflow 6x + 288 oC solder flow 6x, no delamination)
  • Lower Coefficient of Thermal Expansion (< 3.0% from 50 - 260oC)
  • High heat resistance demonstrated by T-260, T-288 and T-300
  • T-260 > 60 min.
  • T-288 > 20 min.
  • T-300 > 10 min.
  • Over 15 cycles by thermal stress 288 oC and 310 oC, 10 sec solder float.
  • ^#HR02^$High Tg (> 170 oC)
  • Phenolic cured (Dicy Free) system with inorganic filler
  • High Td (decomposition temp. > 340 oC by TGA)
  • Lead free process compatible (260 oC IR reflow 6x + 288 oC solder flow 3x, no delamination)
  • Low Coefficient of Thermal Expansion (< 2.8% from 50 - 260oC)
  • High heat resistance demonstrated by T-260, T-288 and T-300
  • T-260 > 60 min.
  • T-288 > 20 min.
  • T-300 > 10 min.
  • Over 15 cycles by thermal stress 288 oC and 310 oC, 10 sec solder float^#
  • Main Products

    Normal, High Tg, Halogen free FR4.