For Nickel Plating: PME, BEO, BMP, PAP, ALS, PPS-OH, ATP, PN, PPS, POPDH, PS, DEP, PA, TC-EHS, BOZ, HD-M, BBI
For Zinc Plating: IME, BPE, MOME, BPC, BAR, OCBA
For Copper Plating: H1, M, N, JPH, SPS/SP, MPS. DPS, UPS, ZPS,
Special Fine Chemicals: 1.3-propane sultone, 1.4-butane sultone, propargyl chloride, propargyl amine
For Zinc Plating: IME, BPE, MOME, BPC, BAR, OCBA
For Copper Plating: H1, M, N, JPH, SPS/SP, MPS. DPS, UPS, ZPS,
Special Fine Chemicals: 1.3-propane sultone, 1.4-butane sultone, propargyl chloride, propargyl amine
Features
- For nickel plating
- mainly used as leveling agent, brightener, impurities tolerance agent, auxiliary brightener
- for zinc plating
- mainly used as brightener and leveling agent for alkaline cyanide and cyanide-free zinc plating
- for copper plating
- mainly used as brightener of acidic plating copper baths
Main Products
electroplating