Mapsuka Industries Co., Ltd.
OCP 3.0 Bracket — Specification
• Material: Cold-rolled steel (CRS) with nickel plated
• Thickness: 0.8 mm – 1.2 mm
• Form Factor: Available in SFF (Small Form Factor) and LFF (Large Form Factor) dimensions
• Mounting Options: Supports thumbscrew or latch fastening
• Compliance:
o EMI shielding requirements
o Thermal dissipation considerations
o RoHS Directive compliance
• Material: Cold-rolled steel (CRS) with nickel plated
• Thickness: 0.8 mm – 1.2 mm
• Form Factor: Available in SFF (Small Form Factor) and LFF (Large Form Factor) dimensions
• Mounting Options: Supports thumbscrew or latch fastening
• Compliance:
o EMI shielding requirements
o Thermal dissipation considerations
o RoHS Directive compliance
| PICMG | CompactPCI |
|---|
Main Products
CompactPCI chassis, VME Ejector handles, Front panels, PCB holders, EMC gaskets, Card Accessories, Fan units, Subracks, Backplanes, PMC bezels, Insulating Strips, Blades, cPCI power supply
Related Products
Contact Detail
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Sales ContactSales Manager Erin Kao
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AddressNo.23 Ching Shyang St., Tu Cheng District, New Taipei City, Taiwan
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Tel886-2-22690567
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Fax886-2-22690327
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E-mail
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URL